In a recent review study "Copper/Epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms" which was published by Philipp Nothchair and his team at chemistry department of University of Leoben, Austria in February 2019, highlights the importance of copper adhesion to dielectric in PCB manufacturing.
The study establishes that improvements and novel copper treatment chemistry and processes are required to keep up with the new high speed board designs. The reviewed copper surface treatment technologies demonstrates the complexity of the copper adhesion phenomenon to advanced dielectric.
This study concludes that "The manufacturing of PCB is a dynamic and constantly evolving industry, and the adhesion strength in copper/epoxy joints is of high importance for performance and reliability".
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