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LATEST 3rd PARTY TEST RESULTS (Nov 2019)

Ajinomoto Build-up Film (ABF) GX92 and GXT31

Copper Roughness and Peel Strength Data

Cu foil adhesion with GX92/GXT31

1. GX92 and GXT31 vacuum lamination to CCL; 100 deg C, 30 sec-vacuum, 30 sec-            press (7kgf/cm2)

2. After removing PET from GX92 and GXT31, Cu foil vacuum lamination to ABF resin        surface; 100 deg C, 30 sec-vacuum, 30 sec-press (7kgf/cm2), 
    Metal press; 100 deg.C, 60 sec-press (5.5 kgf/cm2)

3. Pre-cure; 100 deg.C x30 min & 180 deg C x30 min & cut samples

4. Peel off the Cu Foil, measure peel strength

5. Full-cure; 190 deg C 60 min, again (4) 

Surface Treatment (2 min 23 C)      DI spray rinse (30sec 23 C)      Dry

3rd party test results (May 2019)

Ajinomoto Build-up Film (ABF) GX92

Copper Roughness, Peel Strength and Humidity Test Data

1. CuP-100 Treatment

              Surface Treatment (1 min 23 C)     DI spray rinse (30 sec 23 C)     Dry

2. Competitor A Alternative Oxide Treatment

              Soft Cleaner     Conditioner (1 min 50 C)     Coating (6 min  70 C) 

              Reducer (1 min 30 C)     Protector (1 min 30 C)

ADDITIONAL PERFORMANCE DATA

 

CuP-600  & CuP-100  evaluation on

  • Panasonic Megtron 6 R-5775K

  • Rogers Laminates, including RO3003

TM

TM

You can see the results of tests below in this file:

  1. Soldermask adhesion test (IPC-TM-650 #2.4.28.1)

  2. Copper etch rate by weight loss method

  3. DuPont Riston LDI7330 dry film adhesion test (IPC-TM-650 #2.4.1.6)

  4. Tin plating adhesion test (IPC-TM-650 #2.4.28.1)

  5. Copper surface SEM analysis