CuP-600

TM

Cup-600  Patent Pending, Copper Adhesion Promoter: provides superior bonding for effective adhesion of copper to inorganic and organic substrates, such as prepreg.  CuP-600   is the latest in a series of copper surface preparation family of products. For data sheet and more information check the file below.

TM

TM

TM

116 Research Dr, Suite 129

Bethlehem, PA 18015

USA

Member of IPC

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