116 Research Dr, Suite 129

Bethlehem, PA 18015

USA

Member of IPC

©2018 by LBN. Proudly created with Wix.com

CuP-600

TM

Cup-600  Patent Pending, Copper Adhesion Promoter: provides superior mechanical and chemical bonding for effective adhesion of copper to inorganic and organic substrates, such as prepreg.  CuP-600   is the latest in a series of copper surface preparation family of products. For data sheet and more information check the file below.

TM

TM

TM