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CuP-600
TM
CuP-600 provides superior copper surface treatment, to enhance bonding of smooth copper to inorganic and organic substrates, such as prepreg. CuP-600 is a patent pending advanced novel cost effective alkaline aqueous surface treatment formulation used in multiple copper surface prep applications. CuP-600 is the latest in a series of copper surface preparation family of products that minimize the copper oxide layer film thickness.
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CuP-300
TM
CuP-300 provides superior thin film surface treatment. CuP-300 is third in a series of our surface preparation family of products. Low cost of ownership (COO), as it can be diluted.