CuP-600

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CuP-600 provides superior copper surface treatment, to enhance bonding of smooth copper to inorganic and organic substrates, such as prepreg.  CuP-600  is a patent pending advanced novel cost effective alkaline aqueous surface treatment formulation used in multiple copper surface prep applications. CuP-600  is the latest in a series of copper surface preparation family of products that minimize the copper oxide layer film thickness.  

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CuP-300

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CuP-300  provides superior thin film surface treatment.  CuP-300  is third in a series of our surface preparation family of products.  Low cost of ownership (COO), as it can be diluted.

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