Applications for surface treatment process in PCB operations are:

 

  • Copper surface clean

  • Pre dry film deposition

  • Pre applying solder mask

  • Pre final surface finish; Tin, Silver, ENIG and HASL

  • Pre laminate to copper adhesion

  • Resist strip

 

Benefits of CuP products:

  • 1. Minimize insertion loss due to skin effect

  • 2. Minimize copper oxides thickness

  • 3. Operate in either immersion or spray mode

  • 4. Lower cost of ownership (COO)

  • 5. Reduce dielectric surface ionic contamination

  • 6. Reduce wastewater treatment costs

  • 7. Cu bath loading does not affect performance

  • 8. Provide adhesion without increased Cu roughness

  • 9. Removes most oils and surface contamination

  • 10. Process is simple with few steps