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USA

Member of IPC

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Applications for surface treatment process in PCB operations are:

 

  • Surface clean

  • Plating copper on top of copper foil

  • Laminate to copper adhesion

  • Dry Film deposition

  • Applying solder mask

  • Resist strip

  • Final surface finish, tin, silver, ENIG and HASL

 

 

Benefits of CuP products:

 

  • Low cost of ownership and used at ambient temperature

  • Can be used in either immersion or spray mode

  • Process is simple with few steps providing both mechanical and chemical bonding

  • No etch, removes only copper oxides

  • Minimize insertion loss due to skin effect

  • Improve adhesion without increased copper roughness

  • Simple and sludge free processing

  • Copper bath loading does not affect performance

  • Removes oils and surface greases

  • Does not require adhesion promotion coatings

  • Minimum moisture pickup on copper surface post treatment