Applications for surface treatment process in PCB operations are:


  • Copper surface clean

  • Pre dry film deposition

  • Pre applying solder mask

  • Pre final surface finish; Tin, Silver, ENIG and HASL

  • Pre laminate to copper adhesion

  • Resist strip


Benefits of CuP products:

  • Minimize copper oxide thickness

  • Minimize insertion loss due to skin effect

  • Improve adhesion of final finish

  • Minimum copper sludge build up in the treatment bath

  • Cu bath loading does not affect performance

  • Removes surface oils and greases

  • May not require an additional adhesion promotion coating

  • Prevent delamination due to copper oxide fracture


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