Applications for surface treatment process in PCB operations are:
 

• Thin-film surface preparation

• Copper surface clean

• Pre dry film deposition

• Pre applying solder mask

• Pre final surface finish; Tin, Silver, ENIG and HASL

• Pre laminate to copper adhesion

• Resist strip removal

• Post CMP and Post Etch residue from metal and dielectrics

 

Benefits of CuP products:
 

• Minimize insertion loss due to skin effect

• Minimize copper and metal oxides thickness

• Operate in either immersion or spray mode

• Lower cost of ownership (COO)

• Reduce dielectric surface ionic contamination

• Reduce wastewater treatment costs

• Bath loading does not affect performance

• Provide adhesion without increased Cu roughness

• Removes most oils and surface contamination

• Process is simple with few steps