CuP Products are a novel cost-effective alkaline aqueous surface preparation formulation and adhesion promoter used for multiple applications including advanced packaging. CuP Products provide superior insertion loss control for high-speed applications. For example, Cup-600 is fully qualified as an adhesion promoter for ABF BUGX-92 dielectric.

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Custom Products
LBN also offers custom product development. We welcome the opportunity to formulate products for unique applications.

 

Products
The uses for LBN products are many and varied and are referred to by many different names that are familiar in various applications and industries. These include:

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• Adhesion Promoter

• Thin-film surface preparation

• Copper surface cleaning 

• Corrosion inhibitors

• Solar Cell Cleaning

• Hard Surface Critical Cleaning

• Surface Contamination Removal

• Semiconductor Substrate Cleaning

• Thick Film Resist Stripping

• Wafer Level packaging (WLP)

• Aluminum Corrosion Inhibitor

• Copper Corrosion Inhibitor

• Sidewall Polymer Removal

• Solder Bump

• Photo Resist Stripping

• Post Etch Removal

• Post Etch Clean

• Wafer Cleaning

• Wet Process Chemicals

• Contact Clean

• Chemical Mechanical Polishing (CMP)

• Wet Process Chemicals

• Electronics Grade Materials

• Semiconductor Chemicals

• Semiconductor Fabrication
   

Analytical Capabilities

• Field Emission SEM

• FIB

• AFM

• ESCA

• UV-Vis NIR DSR Spectroscopy

• FTIR

• DSC/TGA

• DMA/TMA/DEA

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