CuP-1000

TM

CuP-1000 is the next generation copper surface prep formulation. CuP-1000  is to be used for high speed >20 GHz PCB designs where Insertion Loss must be minimized.

 

CuP-1000   benefits;

1- Removes contamination

2- Minimizes copper oxide thickness

3- Protects the copper from further oxidation

4- Enhance copper adhesion to low K epoxy-based dielectric laminates, etc.

5- Simple processing

6- Long bath life

7- Low online process monitoring and control

TM

TM

TM