CuP-1000 is the next generation copper surface prep formulation. CuP-1000 is to be used for high speed >20 GHz PCB designs where Insertion Loss must be minimized.
1- Removes contamination
2- Minimizes copper oxide thickness
3- Protects the copper from further oxidation
4- Enhance copper adhesion to low K epoxy-based dielectric laminates, etc.
5- Simple processing
6- Long bath life
7- Low online process monitoring and control