CuP-100  can be diluted for use in both mechanical and chemical micro-etching processes.

CuP-100 has been successfully used in brush cleaning systems for copper surface prep/cleaning in high volume productions after copper pumice scrub type processes, etc.

CuP-100 is a cost effective surface prep formulation providing controlled copper surface for better solder mask, dry film and resist bonding.

CuP-100 is a novel cost effective alkaline aqueous surface preparation formulation used for multiple applications. CuP-100 provides superior substrate cleaning with controlled copper roughness. CuP-100 is the first in a series of copper surface preparation family of products.

CuP-100 is capable of providing:

- Controlled copper etch and surface roughness

- Organic and inorganic contamination removal from various surfaces

- Improved adhesion of solder mask, dry film and resist bonding with copper

Benefits

• Low cost of ownership. (May be used diluted)

• Qualified and used in production for various surface preparation applications

• Suitable for both batch and single wafer processing tools

• Suitable for use with both megasonics and ultrasonics

• Reduces need for brush scrubbing

• Short process time (30 sec - 60 sec)

• DI Rinse

• Can handle significant water/copper contamination

• Does not foam

• Does not contain KOH

• Low energy consumption (operated at ambient to 40 C temperature)