CuP Products can be diluted for use in both mechanical and chemical micro-etching processes.
CuP Products have been successfully used in brush cleaning systems for copper surface prep/cleaning in high volume productions after copper pumice scrub type processes, etc.
CuP Products are a cost effective surface prep formulation providing controlled copper surface for better solder mask, dry film and resist bonding.
CuP Products are a novel cost effective alkaline aqueous surface preparation formulation used for multiple applications. CuP Products provide superior substrate cleaning with controlled copper roughness.
CuP Products are capable of providing:
- Controlled copper etch and surface roughness
- Organic and inorganic contamination removal from various surfaces
- Improved adhesion of solder mask, dry film and resist bonding with copper