LBN Technology

CuP Products

CuP Products  can be diluted for use in both mechanical and chemical micro-etching processes.

CuP Products have been successfully used in brush cleaning systems for copper surface prep/cleaning in high volume productions after copper pumice scrub type processes, etc.

CuP Products are a cost effective surface prep formulation providing controlled copper surface for better solder mask, dry film and resist bonding.


CuP Products are a novel cost effective alkaline aqueous surface preparation formulation used for multiple applications. CuP Products provide superior substrate cleaning with controlled copper roughness.


CuP Products are capable of providing:


- Controlled copper etch and surface roughness

- Organic and inorganic contamination removal from various surfaces

- Improved adhesion of solder mask, dry film and resist bonding with copper


Copper Surface SEM Analysis Results

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